Here is a proposed 200-module, year-long graduate-level multi-disciplinary engineering course that covers the full spectrum of processes from EDA design and verification to nanofabrication manufacturing, including theory, design, LEAN workshops, FMEA, quality planning, jigs, fixtures, robotics, and automation:

Fundamentals of Semiconductor Physics and Devices (20 modules):

1-5: Solid-State Physics and Band Theory

6-10: Carrier Transport and Semiconductor Properties

11-15: PN Junctions and Diodes

16-20: MOSFETs and Bipolar Junction Transistors (BJTs)

Electronic Design Automation (EDA) and Verification (30 modules):

21-25: Digital Design and HDLs (VHDL, Verilog)

26-30: Analog and Mixed-Signal Design

31-35: Design Verification and Testbenches

36-40: Logic Synthesis and Optimization

41-45: Physical Design and Place-and-Route

46-50: Design for Testability (DFT) and Automatic Test Pattern Generation (ATPG)

Nanofabrication Processes and Techniques (40 modules):

51-55: Lithography (Optical, EUV, E-Beam)

56-60: Thin Film Deposition (PVD, CVD, ALD)

61-65: Etching and Patterning (Wet, Dry, RIE)

66-70: Ion Implantation and Diffusion

71-75: Chemical-Mechanical Planarization (CMP)

76-80: Metrology and Process Control

81-85: Packaging and Interconnects

86-90: Advanced Process Integration (FinFET, GAA, 3D)

Design for Manufacturing (DFM) and Yield Optimization (30 modules):

91-95: DFM Principles and Methodologies

96-100: Process Variability and Statistical Design

101-105: Design Rule Checking (DRC) and Layout Versus Schematic (LVS)

106-110: Critical Area Analysis and Yield Prediction

111-115: Process Window Optimization and Design Centering

116-120: Advanced DFM Techniques (Litho-Friendly Design, Retargeting)

LEAN Manufacturing and Quality Management (30 modules):

121-125: LEAN Principles and Waste Reduction

126-130: Value Stream Mapping and Process Optimization

131-135: Statistical Process Control (SPC) and Six Sigma

136-140: Failure Mode and Effects Analysis (FMEA)

141-145: Advanced Product Quality Planning (APQP)

146-150: Continuous Improvement and Kaizen Events

Automation, Robotics, and Industry 4.0 (30 modules):

151-155: Sensors, Actuators, and PLC Programming

156-160: Industrial Robotics and Motion Control

161-165: Machine Vision and Automated Inspection

166-170: Advanced Process Control (APC) and Fault Detection

171-175: Internet of Things (IoT) and Smart Manufacturing

176-180: Cybersecurity and Data Analytics for Manufacturing

Jigs, Fixtures, and Material Handling (10 modules):

181-185: Jig and Fixture Design Principles

186-190: Automated Material Handling and Storage Systems

Capstone Project and Interdisciplinary Skills (10 modules):

191-195: Project Management and Teamwork

196-200: Technical Writing, Presentation, and Communication Skills

Throughout the course, students will engage in hands-on labs, design projects, and case studies that integrate the various aspects of semiconductor manufacturing, from initial design to final production. The curriculum emphasizes the interdisciplinary nature of modern nanofabrication, with a focus on developing a deep understanding of the interactions between design, process, and manufacturing decisions.

By the end of this comprehensive program, students will have a strong foundation in the principles and practices of semiconductor manufacturing, from EDA design to advanced automation and Industry 4.0 concepts. They will be well-prepared for leadership roles in the semiconductor industry, with the skills and knowledge needed to drive innovation and optimize production in a rapidly evolving technological landscape. The course also fosters the development of essential interdisciplinary skills, such as project management, teamwork, and effective communication, which are critical for success in today’s collaborative engineering environment.